Monolith SE 132-1
Flexible epoxy, hardness approx. 70 Shore-A. It has high elongation and flexibility, meets the requirements for stresses caused by impact, peeling when bonding materials with different coefficients of thermal expansion.
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Monolith® SE 132-1 is a two-component, modified epoxy adhesive intended for bonding, sealing and pouring. It has excellent adhesion to Nylon, ABS, polycarbonate and other plastics, as well as many different metals. Soft and flexible, with low shrinkage and low show through. Excellent mass for potting sensitive electronic components, low shrinkage ensures less stress on sensitive components. Cures at ambient temperature and is self-leveling. Pot life is 20-50 minutes, and hand strength is achieved in less than two hours.
Monolith® SE 132-1 provides excellent resistance to thermal shock. It shows no shrinkage, therefore no surface pits or tensile stresses are observed under these conditions.
It has high elongation and flexibility, meets the requirements for stresses caused by impact, peeling when bonding materials with different coefficients of thermal expansion. Monolith® SE 132-1 has excellent environmental resistance and remains very flexible.
Successor to the Monolith 105-1.
Features & Benefits
Adhesion to a wide variety of substrates
Full cure at room temperature
Easy to apply - use in most weather conditions
Resistant to weather conditions - it does not crack or peel off
Self-levelling
Ideal for electronic potting & encapsulation applications
Package:
- 50 ml - cartridge
- 400 ml - cartridge
E3820007PB
Data sheet
- Color
- Charcoal black
- Consistency
- pasty
- Mixing ratio (by volume - A: B)
- 2:1
- Thermal resistance [°C]
- -40 / +90
- Maximum gap [mm]
- mniej niż 0.5 mm
- Pot life after mixing [min]
- 20-50
- Time to achieve initial strength at RT
- 105-120 min.
- Time to reach final strength at RT
- 72 hrs.
- Application area
- Self-leveling,Ideal for electronic potting & encapsulation applications
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Flexible epoxy, hardness approx. 70 Shore-A. It has high elongation and flexibility, meets the requirements for stresses caused by impact, peeling when bonding materials with different coefficients of thermal expansion.